Technical papers

Aluminum to aluminum Bonding at Room Temperature

Chip to wafer direct bonding technologies for high density 3D integration

A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

Ultrathin 3D ACA FlipChip-In-Flex Technology

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SET Technical Bulletin N°3