技术论文

技术论文: 专注于接合!

Quantum Computing

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Qubit compatible superconducting interconnects

Micro-tube insertion into aluminum pads: Simulation and experimental validations

IMAPS 2013 专注于接合 CEA – LETI, MINATEC Campus 下载

9th International Conference and Exhibition on Device Packaging

This material is posted here with permission of IMAPS.

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

IMAPS 2010 专注于接合 RTI International 下载

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Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

Device Packaging 2009 专注于接合 CEA-LETI 下载

This material is posted here with permission of Imaps.

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array

ECTC 2008 专注于接合 CEA-LETI 下载

This material is posted here with permission of IEEE.

RF MEMS and flip-chip for space flight demonstrator

June 2009 专注于接合 Thales Alenia Space 下载

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

EPTC 2014 专注于接合 IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France Singapore 下载

Development done on Device Bonder to address 3D requirements in a production environment

IWLPC 2014 专注于接合 SET Saint-Jeoire, France San Jose, CA 下载

Chip to wafer direct bonding technologies for high density 3D integration

ECTC 2012 专注于接合 CEA – LETI, MINATEC, STMicroelectronics, SET 下载

High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch

June 2014 专注于接合 RTI International 下载

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

June 2014 专注于接合 IME - Journal of Electronics materials (abstract) 下载

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

ECTC 2010 专注于接合 Institute of Microelectronics - A*STAR 下载

This material is posted here with permission of IEEE.

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SPIE Defense, Sensing & Security 2010 专注于接合 HRL Laboratories 下载

Copyright 2010 SPIE

SET Technical Bulletin N°3

February 2010 专注于接合 CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc... 下载

Ultrathin 3D ACA FlipChip-In-Flex Technology

ECTC 2010 专注于接合 Berlin Technical University, NB Technologies and Fraunhofer IZM 下载

This material is posted here with permission of IEEE.

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

June 2014 专注于接合 RTI International 下载

Chip to wafer copper direct bonding electrical characterization and thermal cycling

December 2013 专注于接合 CEA – LETI, MINATEC Campus 下载

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration

ECTC 2010 专注于接合 IMEC and the Katholieke Universiteit Leuven 下载

This material is posted here with permission of IEEE.

Aluminum to aluminum Bonding at Room Temperature

ECTC 2013 专注于接合 CEA – LETI, MINATEC Campus 下载

A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications

ECTC 2011 专注于接合 CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M 下载

This material is posted here with permission of IEEE.

Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly

ECTC 2011 专注于接合 IBM T.J. Watson Research Center 下载

This material is posted here with permission of IEEE.

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

7-12 September, 2014 专注于接合 UNIVERSITY OF SURREY, Guilford, Surrey, U.K. 10th International Conference on Position Sensitive Detectors 下载

Embedded active device packaging technology for real DDR2 memory chips

IWLPC 2010 专注于接合 Industrial Technology Research Institute (ITRI) 下载

Originally published in the IWLPC Proceedings

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

June 30, 2016 专注于接合 DPNC, University of Geneva, Switzerland 下载

Toward a flip-chip bonder dedicated to direct bonding for production environment

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IWLPC October 24, 2017    SET, Saint-Jeoire, France

3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

ECTC 2015 专注于接合 IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France 下载

Development done on Device Bonder to address 3D requirements in a Production Environment

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IWLPC 2014 focus on bonding SET, Saint-Jeoire, France

Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes

技术论文: 专注于纳米压印!

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

November 2008 专注于纳米压印 IISB 下载

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

September 2008 专注于纳米压印 IISB 下载

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

September 2008 专注于纳米压印 IISB 下载

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

November 2008 专注于纳米压印 IISB 下载

UV nanoimprinting lithography using nanostructured quartz molds with antisticking functionalization

September 2008 专注于纳米压印 IISB 下载

UV nanoimprint lithography process optimization for electron device manufacturing on nanosized scale

November 2008 专注于纳米压印 IISB 下载

NaPANIL “Library of Processes”

March 2012 专注于纳米压印 NaPANIL 下载

Second edition with results of the NaPANIL-project

NaPANIL “Library of Processes”

March 2012 专注于纳米压印 NaPANIL 下载

Second edition with results of the NaPANIL-project

NaPANIL “Library of Processes”

March 2012 专注于纳米压印 NaPANIL 下载

Second edition with results of the NaPANIL-project

会议记录

Opto-electronics flip-chip bonding automation and in-situ quality monitoring

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Aurélien Griffart from SET at EMPC – Pisa, Italy, September 16-19, 2019  

Flip-chip bonding: how to meet the high accuracy requirements ?

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Caroline Avrillier from SET at EMPC – Warsaw, Poland, September 10-13, 2017  

Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme

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Keith Cooper from SET North America at IWLPC 2011

3D-IC Integration using D2C or D2W Alignment Schemes together with Local Oxide Reduction

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Gilbert Lecarpentier from SET at Imaps Device Packaging 2011

Chip-to-Wafer Technologies for High Density 3D Integration

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Penned by CEA Leti, Minatec campus, CNRS Cemes, ALES, SET, ST Microelectronics and presented at MinaPad 2011

Flip-chip die bonding: an enabling technology for 3D integration

会议记录

Keith Cooper from SET North America at IWLPC 2010

Flip-Chip Assembly FPA

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Jean-Stéphane Mottet from SET at ORION – Moscow XXII International Conference Photoelectronics and Night Vision Devices, May 28th, 2014

Flip-chip assembly for focal plane array

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Pascal Metzger from SET at IST :GST – Mumbai, India, November 25-26, 2017  

Die-to-wafer bonding of thin dies using a 2-step approach: high accuracy placement, then gang bonding

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Gilbert Lecarpentier from SET at Imaps Device Packaging 2010

Die-to-Die and Die-to-Wafer Bonding solution for High Density, Fine Pitch Micro-Bumped Die

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Gilbert Lecarpentier from SET at Imaps Device Packaging 2012

Toward a flip-chip bonder dedicated to direct bonding for production environment

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Pascal Metzger from SET at IWLPC – San Jose, CA, USA, October 24-25, 2017  

High Accuracy Flip-Chip Equipement

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Nicolas Raynaud from SET at European 3D Summit – Grenoble, France, 18-20 January 2016

Development done on Device Bonder to Address 3D Requirements in a Production Environment

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Pascal Metzger from SET at IWLPC, San Jose, November 11-13, 2014

纳米压印光刻技术

NPS300纳米印刻步进机

纳米压印光刻技术

纳米压印光刻技术

纳米结构的低成本生产方案正在开发中,这可能是半导体、MOEMS与光电子技术未来发展的驱动力。特别是,纳米压印光刻技术(NIL)及其变体已发展成为一种具有成本效益的技术,它可以替代高分辨率电子束光刻技术来印刷小于20纳米的几何形状。

印刻的原理是采用热机械或是紫外线固化工艺,使用带有纳米图案的印模对聚合物薄膜进行机械按压。带有图案的聚合物可以作为最终设备,例如成像传感器的透镜、微流控芯片、生物医学阵列等。它也可以作为一种高分辨率掩模应用于随后的工艺步骤中。

印刻是一种简单的光刻技术。它有三个基本的工艺步骤:

  • 将印模与已预涂印刻材料的基板进行对准
  • 将印模压入印刻材料以转印印模表面上的图案
  • 将印模从印刻材料中分离出来

我们可以描述三种印刻或压印技术:热压印光刻技术 (HEL),其使用热塑性材料;紫外纳米压印技术(UV-NIL),其使用液体抗蚀剂并在成型后用紫外光进行固化;以及软光刻技术,其使用冲压方法将预先在软印模上处理好的油墨转印到基板上。