NEO W

The NEO W Flip-Chip Bonder is a production equipment for thercompression assembly.
It is designed for ± 1 µm @ 3 σ post-bond accuracy in stand-alone or fully automatic mode.
It combines high precision, flexibility, and short cycle-time.

 

 

 

 

Key benefits

  • ± 1 µm @ 3 σ post-bond accuracy
  • Fully automatic functions
  • User-friendly interface
  • High repeatability thanks to closed-loop systems
  • Compatible from stand-alone to fully automatic
  • Cleanliness level: ISO 5 stand-alone / ISO 3 full automatic

Processes

  • Hybrid / direct bonding at room temperature
  • Flip-chip bonding, die bonding

Applications

  • Chip-to-Wafer, wafer level applications
  • Chip-to-Substrate
  • Pick & Place

Markets

  • Telecommunications, 5G, 6G
  • Memory stacking
  • 3D IC
  • HPC
  • AI

Technical data

Click here to request the NEO W datasheet.